CAD package for the prediction and reduction of radio-frequency interference from microprocessor based electronic equipment

The object of this work is the production of an EMC CAD package for use in the design of electronic computing equipment. The design of electronic equipment is usually split up into several separate areas such as circuit design, circuit layout, enclosure design, and thermal design. EMC considerations should be taken into account at all stages in the design process. The radiated emission performance of a piece of equipment design depends on the logic family used in implementation, the circuit card layout, its orientation within the enclosure and the enclosure material and construction. Power and interconnection cables are critical, with the conducted emissions also being part of the problem.